![]() ![]() This is done by making a stencil on the board and creating openings at places where the solder ball tends to be produced so that the tin paste will flow to the openings.ĪOI: Short for automated optical inspection, AOI refers to a type of inspection method used to find potential problems concerning soldering performance in multi-layer PCBs with components mounted on. This ring is measured from the edge of the pad to the edge of the hole and is an important consideration in PCB design, as it allows an electrical connection to be made from one side of the hole to the other.Īnti-Solder Ball: This type of technology is commonly applied in SMT production lines with the goal of limiting the amount of tin involved in the stencil process. The output is non-binary within this type of circuit.Īnnular Ring: This term refers to the copper pad area that is left after a hole is drilled through it. ALIVH often replaces traditional vias and is a useful production method for creating high-density BUM PCBs.Īnalog Circuit: It refers to circuits processing analog signals (continuous and variable signal). This method uses a solder to create an electrical connection between PCB layers. For example, a transistor, rectifier or valve would be considered active.ĪLIVH: Short for any layer inner via hole, this is a type of technology used to build multi-layer BUM PCBs. Active Components: This term refers to a type of component that is dependent on the flow direction of an electrical current. ![]()
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